HD64F2319EVTE25 Renesas Electronics America, HD64F2319EVTE25 Datasheet - Page 76

• Manufacturer Part Number: HD64F2319EVTE25
• Description: IC H8S MCU FLASH 512K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2319EVTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 71
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 2 CPU
2.6
2.6.1
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in
table 2.1.
Table 2.1
Function
Data transfer
Arithmetic
operations
Logic operations
Shift
Bit manipulation
Branch
System control
Block data transfer
Legend:
B: Byte
W: Word
L: Longword
Notes: 1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn,
Rev.7.00 Feb. 14, 2007 page 42 of 1108
REJ09B0089-0700
2. Bcc is the general name for conditional branch instructions.
3. Cannot be used in the H8S/2319 Group.
4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
Instruction Set
Overview
@-SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L
ERn, @-SP.
Instruction Classification
Instructions
MOV
POP *
LDM, STM
MOVFPE, MOVTPE *
INC, DEC
ADDS, SUBS
MULXU, DIVXU, MULXS, DIVXS
EXTU, EXTS
TAS *
AND, OR, XOR, NOT
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BWL
BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND,
BIAND, BOR, BIOR, BXOR, BIXOR
Bcc *
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP —
EEPMOV
ADD, SUB, CMP, NEG
ADDX, SUBX, DAA, DAS
2
4
, JMP, BSR, JSR, RTS
1
, PUSH *
1
3
Size
BWL
WL
L
B
B
BWL
L
BW
WL
B
BWL
B
—
—
Total
BWL
Types
5
4
8
14
5
9
1
65
19