MC68HC711E9CFN3 Freescale Semiconductor, MC68HC711E9CFN3 Datasheet - Page 183

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MC68HC711E9CFN3

Manufacturer Part Number
MC68HC711E9CFN3
Description
IC MCU 3MHZ 12K OTP 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheets

Specifications of MC68HC711E9CFN3

Core Processor
HC11
Core Size
8-Bit
Speed
3MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
12KB (12K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
Freescale Semiconductor
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
A
S
B
N
M68HC11E Family Data Sheet, Rev. 5.1
D
K
S
H
52 PL
0.18 (0.007)
-B-
0.51 (0.020)
-T-
0.15 (0.006)
SEATING
PLANE
M
M
T
T
A
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
A
S
S
B
B
S
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
A
B
C
D
G
H
K
N
R
S
F
J
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
MAX
20.19
20.19
19.20
19.20
18.54
5.08
0.53
0.81
3.30
0.25
1.14
183

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