MC68HC711E20CFN3 Freescale Semiconductor, MC68HC711E20CFN3 Datasheet - Page 23
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MC68HC711E20CFN3
Manufacturer Part Number
MC68HC711E20CFN3
Description
IC MCU 3MHZ 20K OTP 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Specifications of MC68HC711E20CFN3
Core Processor
HC11
Core Size
8-Bit
Speed
3MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
20KB (20K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
52-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68HC711E20CFN3
Manufacturer:
FREESCALE
Quantity:
4 463
Company:
Part Number:
MC68HC711E20CFN3
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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1.1 Contents
1.2 Introduction
M68HC11E Family — Rev. 3.2
MOTOROLA
Technical Data — M68HC11E Family
1.2
1.3
1.4
This document contains a detailed description of the M68HC11 E series
of 8-bit microcontroller units (MCUs). These MCUs all combine the
M68HC11 central processor unit (CPU) with high-performance, on-chip
peripherals.
With the exception of a few minor differences, the operation of all
E-series MCUs is identical. A fully static design and high-density
complementary metal-oxide semiconductor (HCMOS) fabrication
process allow the E-series devices to operate at frequencies from 3 MHz
to dc with very low power consumption.
The E series is comprised of many devices with various
configurations of:
•
•
•
•
•
Random-access memory (RAM)
Read-only memory (ROM)
Erasable programmable read-only memory (EPROM)
Electrically erasable programmable read-only memory
(EEPROM)
Several low-voltage devices are also available.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
General Description
Section 1. General Description
Technical Data
23
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