STR736FV2T7 STMicroelectronics, STR736FV2T7 Datasheet - Page 47

IC MCU ARM7 256K FLASH 100-TQFP

STR736FV2T7

Manufacturer Part Number
STR736FV2T7
Description
IC MCU ARM7 256K FLASH 100-TQFP
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet

Specifications of STR736FV2T7

Core Processor
ARM7
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
100-TQFP, 100-VQFP
For Use With
497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
497-5146-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STR736FV2T7
Manufacturer:
SONY
Quantity:
101
Part Number:
STR736FV2T7
Manufacturer:
STMicroelectronics
Quantity:
10 000
STR73xFxx
Figure 26. 144-ball low profile fine pitch ball grid array package
Figure 27. Recommended PCB design rules (0.80/0.75mm pitch BGA)
Dpad
Dsm
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
Dim.
ddd
eee
A1
A2
D1
E1
fff
A
b
D
E
e
F
N
1
Values in inches are converted from mm and
1.21
0.21
0.35 0.40 0.45 0.0138 0.0157 0.0177
9.85 10.00 10.15 0.3878 0.3937 0.3996
9.85 10.00 10.15 0.3878 0.3937 0.3996
Min
rounded to 4 decimal digits.
Package characteristics
1.085
8.80
8.80
0.80
0.60
mm
Typ
Number of Pins
Max
1.70 0.0476
0.10
0.15
0.08
144
0.0083
Min
inches
0.0427
0.3465
0.3465
0.0315
0.0236
Typ
1)
0.0669
0.0039
0.0059
0.0031
Max
47/52

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