PIC16F639-E/P Microchip Technology, PIC16F639-E/P Datasheet - Page 179
PIC16F639-E/P
Manufacturer Part Number
PIC16F639-E/P
Description
IC MCU FLASH 2KX14 20DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F639-ISS.pdf
(6 pages)
Specifications of PIC16F639-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-DIP (0.300", 7.62mm)
For Use With
AC162066 - HEADER INTRFC MPLAB ICD2 20PINAC164039 - MODULE SKT PROMATE II 20DIP/SOICDM163029 - BOARD PICDEM FOR MECHATRONICSACICE0203 - MPLABICE 20P 300 MIL ADAPTER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- PIC16F639-ISS PDF datasheet #5
- Current page: 179 of 234
- Download datasheet (4Mb)
15.8
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03 T
TH04 PD
TH05 P
TH06 P
TH07 P
Note 1:
Para
No.
m
2:
3:
JA
JC
Thermal Considerations
J
INTERNAL
I
DER
/
O
Sym
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
= Ambient Temperature.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C
Characteristic
T
A
+125°C
DER
).
PIC12F635
PIC16F636
PIC16F639 108.1
PIC12F635
PIC16F636
PIC16F639 32.2
PIC12F635/PIC16F636/639
163.0
100.4
84.6
52.4
52.4
69.8
85.0
46.3
41.2
38.8
32.5
31.0
31.7
Typ
150
3.0
3.0
2.6
—
—
—
—
Units
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
°C/W 8-pin DFN-S 6x5 mm package
°C/W 14-pin PDIP package
°C/W 14-pin SOIC package
°C/W 14-pin TSSOP package
°C/W 16-pin QFN 4x0.9mm package
°C/W 20-pin SSOP package
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
°C/W 8-pin DFN-S 6x5 mm package
°C/W 14-pin PDIP package
°C/W 14-pin SOIC package
°C/W 14-pin TSSOP package
°C/W 16-pin QFN 4x0.9mm package
°C/W 20-pin SSOP package
°C
W
W
W
W
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
=
= (T
INTERNAL
(I
OL
J
= I
- T
* V
DD
A
Conditions
)/
OL
+ P
x V
JA
) +
DD
I
/
O
DS41232D-page 177
(I
OH
* (V
DD
- V
OH
))
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