DSPIC30F6013T-20I/PF Microchip Technology, DSPIC30F6013T-20I/PF Datasheet - Page 215
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DSPIC30F6013T-20I/PF
Manufacturer Part Number
DSPIC30F6013T-20I/PF
Description
IC DSPIC MCU/DSP 132K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F6014-20IPF.pdf
(228 pages)
2.DSPIC30F5011T-20IPT.pdf
(34 pages)
3.DSPIC30F6010T-20IPF.pdf
(10 pages)
4.DSPIC30F6011T-20IPF.pdf
(12 pages)
Specifications of DSPIC30F6013T-20I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F6013T20IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6013T-20I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F6014-20IPF PDF datasheet
- DSPIC30F5011T-20IPT PDF datasheet #2
- DSPIC30F6010T-20IPF PDF datasheet #3
- DSPIC30F6011T-20IPF PDF datasheet #4
- Current page: 215 of 228
- Download datasheet (4Mb)
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-116
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
See ASME Y14.5M
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
c
Dimension Limits
#leads = n1
E1
E
Units
dsPIC30F6011/6012/6013/6014
A2
D1
n1
E1
A1
n
p
A
L
F
E
D
c
B
n
MIN
.037
.002
.018
.004
.011
11°
11°
2
1
0°
L
D1
INCHES
.039 REF.
.630 BSC
.630 BSC
.551 BSC
.551 BSC
A
NOM
A1
D
.026
.039
.024
.013
3.5°
12°
12°
80
20
MAX
(F)
.047
.041
.006
.030
.008
.015
13°
13°
7°
MIN
0.95
0.05
0.45
0.09
0.27
11°
11°
0°
MILLIMETERS*
Revised 7-20-06
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF.
NOM
0.65
1.00
0.60
0.32
3.5°
12°
12°
80
20
DS70117F-page 213
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.37
13°
13°
7°
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