PIC16C57C-20I/SPG Microchip Technology, PIC16C57C-20I/SPG Datasheet - Page 175
PIC16C57C-20I/SPG
Manufacturer Part Number
PIC16C57C-20I/SPG
Description
IC MCU OTP 2KX12 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C57C-20I/SPG
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
3KB (2K x 12)
Program Memory Type
OTP
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
For Use With
DVA16XP280 - ADAPTER DEVICE FOR MPLAB-ICE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
A1
A
Preliminary
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
22.80
PIC16C5X
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
DS30453D-page 173
MAX
A2
L
22.99
10.92
3.68
8.26
6.60
3.43
0.38
1.78
0.56
4.32
15
15
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