PIC18LF448-I/L Microchip Technology, PIC18LF448-I/L Datasheet - Page 382

• Manufacturer Part Number: PIC18LF448-I/L
• Description: IC PIC MCU FLASH 8KX16 44PLCC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18LF448-I/L

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 33
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-PLCC
• Controller Family/series: PIC18
• No. Of I/o's: 33
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SPI, I2C, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 33
• Number Of Timers: 4 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136, DM163011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS41159E-page 380
PIC18FXX8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
§
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES *
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.012
.420
.299
.104
.094
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8