PIC16LC717-E/P Microchip Technology, PIC16LC717-E/P Datasheet - Page 204
![IC MCU OTP 2KX14 A/D PWM 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16LC717-E/P
Manufacturer Part Number
PIC16LC717-E/P
Description
IC MCU OTP 2KX14 A/D PWM 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16LC717-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
15
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
PIC16LC717E/P
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PIC16C717/770/771
17.5
DS41120B-page 202
20-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
n
eB
E1
E
Dimension Limits
§
2
1
D
c
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
A1
A
MIN
1.025
.140
.115
.015
.295
.240
.120
.008
.055
.014
.310
5
5
B
INCHES*
B1
NOM
1.033
.100
.155
.130
.310
.250
.130
.012
.060
.018
.370
20
10
10
MAX
1.040
.170
.145
.325
.260
.140
.015
.065
.022
.430
15
15
MIN
26.04
3.56
2.92
0.38
7.49
6.10
3.05
0.20
1.40
0.36
7.87
5
5
MILLIMETERS
p
NOM
2002 Microchip Technology Inc.
26.24
6.35
2.54
3.94
3.30
7.87
3.30
0.29
1.52
0.46
9.40
A2
20
10
10
L
MAX
26.42
10.92
4.32
3.68
8.26
6.60
3.56
0.38
1.65
0.56
15
15
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