PIC16F874-04E/P Microchip Technology, PIC16F874-04E/P Datasheet - Page 21
PIC16F874-04E/P
Manufacturer Part Number
PIC16F874-04E/P
Description
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F873-04SO.pdf
(218 pages)
4.PIC16F873-04SO.pdf
(5 pages)
5.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F874-04E/P
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC16F87404E/P
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F874-04E/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
PIC16F874-04E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F873-04SO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- Current page: 21 of 688
- Download datasheet (3Mb)
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
Related parts for PIC16F874-04E/P
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44PLCC
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44TQFP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44PLCC
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,QFP,44PIN,PLASTIC
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44PLCC
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44TQFP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44MQFP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44TQFP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44-MQFP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC MCU FLASH 4KX14 EE 44PLCC
Manufacturer:
Microchip Technology
Datasheet: