PIC16C55A-04E/SP Microchip Technology, PIC16C55A-04E/SP Datasheet - Page 183
![IC MCU OTP 512X12 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C55A-04E/SP
Manufacturer Part Number
PIC16C55A-04E/SP
Description
IC MCU OTP 512X12 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C55A-04E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
768B (512 x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
W
n
E1
eB
E
Dimension Limits
§
2
1
Units
A2
eB
A1
E1
B1
c
W
A
E
D
B
n
p
L
c
D
A1
A
MIN
1.430
Preliminary
.195
.155
.015
.595
.514
.125
.008
.050
.016
.610
.270
INCHES*
NOM
1.460
.100
.210
.160
.038
.600
.520
.138
.010
.058
.020
.660
.280
28
MAX
1.490
.225
.165
.060
.625
.526
.150
.012
.065
.023
.710
.290
B
B1
MIN
13.06
36.32
15.49
15.11
4.95
3.94
0.38
3.18
0.20
1.27
6.86
0.41
MILLIMETERS
NOM
15.24
37.08
16.76
13.21
PIC16C5X
2.54
5.33
4.06
0.95
3.49
0.25
1.46
p
0.51
7.11
28
A2
DS30453D-page 181
MAX
15.88
13.36
37.85
18.03
L
5.72
4.19
1.52
0.30
1.65
0.58
7.37
3.81
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