PIC16C54B-04I/SO Microchip Technology, PIC16C54B-04I/SO Datasheet - Page 92

MICRO CTRL 512 4MHZ OTP 18SOIC

PIC16C54B-04I/SO

Manufacturer Part Number
PIC16C54B-04I/SO
Description
MICRO CTRL 512 4MHZ OTP 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16C54B-04I/SO

Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
768B (512 x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Eeprom Size
-
Data Converters
-
Connectivity
-
PIC16C5X
13.2
DS30453B-page 92
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25 C. This data is for design guidance
Supply Voltage
RC, XT and LP options
HS options
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current
RC
HS option
Power-Down Current
DD
DD
(4)
Start Voltage to ensure
Rise Rate to ensure
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
4: Does not include current through Rext. The current through the resistor can be estimated by the
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is
and XT options
DC Characteristics: PIC16CR54A-04E, 10E, 20E (Extended)
only and is not tested.
loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on
the current consumption.
formula: I
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
Characteristic
DC Characteristics
Power Supply Pins
a) The test conditions for all I
b) For standby current measurements, the conditions are the same, except that
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to
V
the device is in SLEEP mode.
ss
(3)
, T0CKI = V
R
= V
(5)
DD
/2Rext (mA) with Rext in k .
DD
(2)
, MCLR = V
DD
V
S
Sym
V
V
I
I
POR
VDD
DD
PD
DD
DR
can be lowered in SLEEP mode without losing RAM data.
DD
DD
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
measurements in active operation mode are:
0.05*
3.25
Min
4.5
; WDT enabled/disabled as specified.
Preliminary
Typ
1.5*
V
1.8
4.8
9.0
5.0
0.8
SS
(1)
Max
6.0
5.5
3.3
10
20
22
18
Units
V/ms
mA
mA
mA
V
V
V
V
–40 C
A
A
Device in SLEEP mode
See Section 7.4 for details on
Power-on Reset
See Section 7.4 for details on
Power-on Reset
F
F
F
V
V
OSC
OSC
OSC
DD
DD
T
A
= 3.25V, WDT enabled
= 3.25V, WDT disabled
= 4.0 MHz, V
= 10 MHz, V
= 16 MHz, V
+125 C (extended)
1998 Microchip Technology Inc.
Conditions
DD
DD
PIC16CR54A
DD
= 5.5V
= 5.5V
= 5.5V
DD
and V
SS
.

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