PIC16C72/JW Microchip Technology, PIC16C72/JW Datasheet - Page 132
![IC MCU EPROM2KX14 A/D PWM 28CDIP](/photos/7/29/72984/150-28-cdip_sml.jpg)
PIC16C72/JW
Manufacturer Part Number
PIC16C72/JW
Description
IC MCU EPROM2KX14 A/D PWM 28CDIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16C72-04SO.pdf
(289 pages)
4.PIC16C72-04SO.pdf
(125 pages)
5.PIC16C72-04SO.pdf
(8 pages)
Specifications of PIC16C72/JW
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
EPROM, UV
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
28-CDIP (0.300", 7.62mm) Window
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C72/JW
Manufacturer:
TI
Quantity:
32
Part Number:
PIC16C72/JW
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16C72-04SO PDF datasheet #3
- PIC16C72-04SO PDF datasheet #4
- PIC16C72-04SO PDF datasheet #5
- Current page: 132 of 289
- Download datasheet (3Mb)
PIC16C7X
14.2.3
Either a prepackaged oscillator can be used or a simple
oscillator circuit with TTL gates can be built. Prepack-
aged oscillators provide a wide operating range and
better stability. A well-designed crystal oscillator will
provide good performance with TTL gates. Two types
of crystal oscillator circuits can be used; one with series
resonance, or one with parallel resonance.
Figure 14-5 shows implementation of a parallel reso-
nant oscillator circuit. The circuit is designed to use the
fundamental frequency of the crystal. The 74AS04
inverter performs the 180-degree phase shift that a par-
allel oscillator requires. The 4.7 k
the negative feedback for stability. The 10 k
ometer biases the 74AS04 in the linear region. This
could be used for external oscillator designs.
FIGURE 14-5: EXTERNAL PARALLEL
Figure 14-6 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental fre-
quency of the crystal. The inverter performs a 180-
degree phase shift in a series resonant oscillator cir-
cuit. The 330 k
back to bias the inverters in their linear region.
FIGURE 14-6: EXTERNAL SERIES
DS30390E-page 132
74AS04
330 k
10k
EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
+5V
0.1 F
XTAL
20 pF
10k
74AS04
XTAL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
resistors provide the negative feed-
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
4.7k
74AS04
330 k
20 pF
10k
74AS04
74AS04
To Other
Devices
resistor provides
To Other
Devices
PIC16CXX
CLKIN
PIC16CXX
CLKIN
potenti-
14.2.4
For timing insensitive applications the “RC” device
option offers additional cost savings. The RC oscillator
frequency is a function of the supply voltage, the resis-
tor (Rext) and capacitor (Cext) values, and the operat-
ing temperature. In addition to this, the oscillator
frequency will vary from unit to unit due to normal pro-
cess parameter variation. Furthermore, the difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
Cext values. The user also needs to take into account
variation due to tolerance of external R and C compo-
nents used. Figure 14-7 shows how the R/C combina-
tion is connected to the PIC16CXX. For Rext values
below 2.2 k , the oscillator operation may become
unstable, or stop completely. For very high Rext values
(e.g. 1 M ), the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend to keep
Rext between 3 k and 100 k .
Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or pack-
age lead frame capacitance.
See characterization data for desired device for RC fre-
quency variation from part to part due to normal pro-
cess variation. The variation is larger for larger R (since
leakage current variation will affect RC frequency more
for large R) and for smaller C (since variation of input
capacitance will affect RC frequency more).
See characterization data for desired device for varia-
tion of oscillator frequency due to V
Cext values as well as frequency variation due to oper-
ating temperature for given R, C, and V
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test pur-
poses or to synchronize other logic (see Figure 3-4 for
waveform).
FIGURE 14-7: RC OSCILLATOR MODE
Cext
Rext
V
SS
V
DD
RC OSCILLATOR
Fosc/4
OSC1
OSC2/CLKOUT
1997 Microchip Technology Inc.
DD
DD
for given Rext/
PIC16CXX
values.
Internal
clock
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