DF3048BVX25WV Renesas Electronics America, DF3048BVX25WV Datasheet - Page 42
![MCU 3/5V 128K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3048BVX25WV
Manufacturer Part Number
DF3048BVX25WV
Description
MCU 3/5V 128K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3048BVX25WV
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3048BVX25WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendices
■
R4: Renesas H8S MCU
ROM type:
H8S device number
(with optional major revision letter)
Package (one- or two-letter code)
Maximum Speed (MHz)
Temperature range:
Package type:
R5: Renesas H8SX MCU
ROM type:
H8SX device number
(with optional major revision letter)
Temperature range (refer to R4 decoder, above)
Maximum Speed (MHz)
Package (one- or two-letter code)
Package type:
F = Flash
M = Mask ROM
S
F = Flash
M = Mask ROM
S
Appendix C-1: Catalog Part Number Decoders (1 of 2)
Blank = -20°C to +75°C (Standard temp.)
= ROMless or Standard Mask ROM
= ROMless or Standard Mask ROM
JE = -40°C to +105°C
K = -40°C to +125°C
V = Lead-free package
V = Lead-free package
J = -40°C to +85°C (Extended reliability)
I = -40°C to +85°C
R 4
R 5
X
X
# # # # X
6 # # # # X
X X
N
# #
# #
X X
X
V
V
40