MC9S12DG128VPVE Freescale Semiconductor, MC9S12DG128VPVE Datasheet - Page 90

• Manufacturer Part Number: MC9S12DG128VPVE
• Description: IC MCU 128K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12DG128VPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 112-LQFP
• Processor Series: S12D
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI/SPI/I2C/CAN
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 8
• Operating Supply Voltage: - 0.3 V to + 6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68KIT912DP256
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (8-ch x 10-bit)
• Package: 112LQFP
• Family Name: HCS12
• Maximum Speed: 50 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MC9S12DT128B Device User Guide — V01.09
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE:
Num C
1
2
3
4
5
Human Body
Machine
Latch-up
Model
C Human Body Model (HBM)
C Machine Model (MM)
C Charge Device Model (CDM)
C
C
Please refer to the temperature rating of the device (C, V, M) with regards to the
ambient temperature T
Latch-up Current at 125 C
positive
negative
Latch-up Current at 27 C
positive
negative
Table A-3 ESD and Latch-Up Protection Characteristics
Series Resistance
Storage Capacitance
Number of Pulse per pin
positive
negative
Series Resistance
Storage Capacitance
Number of Pulse per pin
positive
negative
Minimum input voltage limit
Maximum input voltage limit
Table A-2 ESD and Latch-up Test Conditions
Freescale Semiconductor, Inc.
For More Information On This Product,
Rating
A
Description
and the junction temperature T
Go to: www.freescale.com
Symbol
V
V
V
I
I
HBM
CDM
LAT
LAT
MM
Symbol
J
. For power dissipation
R1
R1
C
C
–
–
2000
+100
–100
+200
–200
Min
200
500
Value
1500
–2.5
100
200
7.5
–
3
3
0
–
3
3
Max
–
–
–
–
–
Unit
Ohm
Ohm
pF
pF
V
V
Unit
mA
mA
V
V
V