MCF5233CVM100J Freescale Semiconductor, MCF5233CVM100J Datasheet - Page 14
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MCF5233CVM100J
Manufacturer Part Number
MCF5233CVM100J
Description
IC MCU 64K SRAM 100MHZ 256MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF523xr
Datasheet
1.MCF5232CVM100J.pdf
(48 pages)
Specifications of MCF5233CVM100J
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
61
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-MAPBGA
Processor Series
MCF523x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5234-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF5233CVM100J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Mechanicals/Pinouts and Part Numbers
5.7.3
The FlexCAN module interface to the CAN bus is composed of 2 pins: CANTX and CANRX, which are
the serial transmitted data and the serial received data. The use of an external CAN transceiver to interface
to the CAN bus is generally required. The transceiver is capable of driving the large current needed for the
CAN bus and has current protection, against a defective CAN bus or defective stations.
5.7.4
Use the BDM interface as shown in the M523xEVB evaluation board user’s manual. The schematics for
this board are accessible at the Freescale website at: http://www.freescale.com/coldfire.
6
This section contains drawings showing the pinout and the packaging and mechanical characteristics of
the MCF523x devices. See
14
Mechanicals/Pinouts and Part Numbers
FlexCAN
BDM
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
Table 2
for a list the signal names and pin locations for each device.
Freescale Semiconductor