MCF5213CAF66 Freescale Semiconductor, MCF5213CAF66 Datasheet - Page 29

• Manufacturer Part Number: MCF5213CAF66
• Description: IC MCU 256K FLASH 66MHZ 100-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF521xr

Specifications of MCF5213CAF66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 55
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Cpu Family: MCF521x
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 66MHz
• Interface Type: I2C/QSPI/UART
• Total Internal Ram Size: 32KB
• # I/os (max): 56
• Number Of Timers - General Purpose: 10
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Package: 100LQFP
• Family Name: MCF521x
• Maximum Speed: 66 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 32 Bit
• Number Of Programmable I/os: 56
• Number Of Timers: 10
• Processor Series: MCF521x
• Core: ColdFire V2
• Data Ram Size: 32 KB
• Maximum Clock Frequency: 66 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52210DEMO, M52211EVB
• Minimum Operating Temperature: - 40 C
• For Use With: M5213EVBE - KIT EVAL FOR MCF5213M5211DEMO - KIT DEMO FOR MCF5211
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Freescale Semiconductor
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81 MAPBGA Junction to ambient, natural convection
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψ
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
64 LQFP
JA
64 QFN
and Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case (bottom)
Junction to top of package
Maximum operating junction temperature
JA
and power dissipation specifications in the system design to prevent device junction
Table 23. Thermal Characteristics (continued)
MCF5213 ColdFire Microcontroller, Rev. 4
Characteristic
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
—
—
—
—
—
—
—
—
—
Symbol
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
Ψ
Ψ
Ψ
JMA
JMA
JMA
JMA
JMA
JMA
T
T
T
JA
JA
JB
JC
JA
JA
JB
JC
JA
JA
JB
JC
jt
jt
j
jt
j
jt
j
parameter, the device power
Electrical Characteristics
Value
61
35
50
31
62
43
50
36
68
24
55
19
0.6
105
105
105
20
12
26
2
9
2
8
3
1,2
2,3
2,3
2,3
6
1,2
1,3
1,3
1,3
5
6
1,2
1,3
1,3
1,3
4
6
4
5
4
5
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
o
o
C
C
C
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