HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 248

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218TF24

Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218TF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 2 Instruction Descriptions
STMAC (STore from MAC register)
Operand Format and Number of States Required for Execution
Note: * A maximum of three additional states are required for execution of this instruction within three states
Notes
Rev. 4.00 Feb 24, 2006 page 232 of 322
REJ09B0139-0400
Register direct
Register direct
Addressing
Mode
after execution of a MAC instruction. For example, if there is a one-state instruction (such as NOP)
between the MAC instruction and this instruction, this instruction will be two states longer.
The number of states may differ depending on the product. For details, refer to the relevant
microcontroller hardware manual of the product in question.
Mnemonic
STMAC
STMAC
MACH, ERd
MACL, ERd
Operands
1st byte
0
0
2
2
2nd byte
2
3
Instruction Format
0 erd
0 erd
Store Data from MAC Register
3rd byte
4th byte
States
No. of
1*
1*

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