MCF53281CVM240J Freescale Semiconductor, MCF53281CVM240J Datasheet - Page 17

• Manufacturer Part Number: MCF53281CVM240J
• Description: IC MPU RISC 240MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF532xr

Specifications of MCF53281CVM240J

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, PWM, WDT
• Number Of I /o: 94
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Processor Series: MCF532xx
• Core: ColdFire V3
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

5.2
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
T
Q
P
P
P
1
2
3
4
5
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
A
JMA
D
INT
I/O
θ
Freescale recommends the use of θ
device junction temperatures from exceeding the rated specification. System designers should be aware that
device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in the
customer’s system using the Ψ
EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written in conformance with Psi-JT.
Thermal Characteristics
JMA
and Ψ
= Ambient Temperature, °C
= Package Thermal Resistance, Junction-to-Ambient, °C/W
= P
= I
= Power Dissipation on Input and Output Pins — User Determined
jt
I/O
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
INT
DD
< P
× IV
+ P
INT
Characteristic
I/O
DD
MCF532x ColdFire
and can be ignored. An approximate relationship between P
, Watts - Chip Internal Power
K
jt
J
) in °C can be obtained from:
=
parameter, the device power dissipation, and the method described in
Table 5. Thermal Characteristics
P
JmA
D
T
J
×
P
and power dissipation specifications in the system design to prevent
(
=
D
Four layer board
Four layer board
T
T
A
®
=
A
×
Microprocessor Data Sheet, Rev. 5
-------------------------------- -
(
+
(2s2p)
(2s2p)
T
273°C
(
J
—
—
—
—
P
+
D
K
273°C
×
)
Θ
+
JMA
Q
)
JMA
)
Symbol
θ
θ
×
θ
θ
Ψ
JMA
JMA
T
JB
JC
P
jt
j
2
D
256MBGA
37
34
4
105
27
16
1,5
1,2
1,2
3
4
D
and T
196MBGA
Electrical Characteristics
42
38
J
32
19
5
105
(if P
1,5
1,2
1,2
3
4
I/O
is neglected) is:
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
C
Eqn. 1
Eqn. 2
Eqn. 3
17