MCF52258AG80 Freescale Semiconductor, MCF52258AG80 Datasheet - Page 28
![MCU 32BIT COLDFIRE V2 144LQFP](/photos/12/39/123905/mcf52258ag80_sml.jpg)
MCF52258AG80
Manufacturer Part Number
MCF52258AG80
Description
MCU 32BIT COLDFIRE V2 144LQFP
Manufacturer
Freescale Semiconductor
Series
MCF5225xr
Datasheet
1.MCF52256CAG66.pdf
(46 pages)
Specifications of MCF52258AG80
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
144-LQFP
Processor Series
MCF522x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
I2C/QSPI/UART
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
96
Number Of Timers
10
Operating Supply Voltage
- 0.3 V to + 4 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
TWR-MCF5225X, TWR-SENSOR-PAK, TWR-SER, TWR-ELEV, TOWER, M52259EVB, M52259DEMOKIT
Minimum Operating Temperature
0 C
On-chip Adc
8-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF52258AG80
Manufacturer:
FREESCALE
Quantity:
20 000
2.4
The flash memory characteristics are shown in
Freescale Semiconductor
1
2
System clock (read only)
System clock (program/erase)
16
17
18
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring P
for a known T
any value of T
Refer to the flash memory section for more information
Depending on packaging; see the orderable part number summary.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
1
Maximum number of guaranteed program/erase cycles
Data retention at average operating temperature of 85C
A program/erase cycle is defined as switching the bits from 1 0 1.
Flash Memory Characteristics
T
P
P
P
A
D
INT
I/O
JA
A
A
. Using this value of K, the values of P
.
Parameter
= ambient temperature, C
= package thermal resistance, junction-to-ambient, C/W
= P
= chip internal power, I
= power dissipation on input and output pins — user determined, watts
I/O
INT
P
Table 9. SGFM Flash Program and Erase Characteristics
P
INT
K = P
2
Table 10. SGFM Flash Module Life Characteristics
I/O
and can be ignored. An approximate relationship between P
Parameter
D
(T
MCF52259 ColdFire Microcontroller, Rev. 4
J
A
) in C can be obtained from:
+ 273 C) +
P
DD
T
Table 9
D
J
V
=
=
K
T
DD
(V
(V
A
D
and
DD
DD
+
, watts
and T
Symbol
f
sys(P/E)
f
T
sys(R)
P
J
= 3.0 to 3.6 V)
= 3.0 to 3.6 V)
JMA
1
Table
+
D
before failure
J
273C
can be obtained by solving equations (1) and (2) iteratively for
P
JMA
10.
D
2
(1)
(2)
(3)
0.15
Min
0
Retention
Symbol
P/E
Typ
—
—
D
and T
Electrical Characteristics
66.67 or 80
66.67 or 80
10,000
J
Value
(if P
10
Max
I/O
2
D
is neglected) is:
(at equilibrium)
1
1
Cycles
Years
Unit
MHz
MHz
Unit
28