MCF5372LCVM240J Freescale Semiconductor, MCF5372LCVM240J Datasheet - Page 2

• Manufacturer Part Number: MCF5372LCVM240J
• Description: IC MPU RISC 240MHZ 196MABGA
• Manufacturer: Freescale Semiconductor
• Series: MCF537xr

Specifications of MCF5372LCVM240J

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 62
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 196-MAPBGA
• Family Name: MCF53xx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 240MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MAPBGA
• Processor Series: MCF537xx
• Core: ColdFire V3
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

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2
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5
2
MCF537x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . .3
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5
3.1
3.2
3.3
Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .6
4.1
4.2
4.3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
5.1
5.2
5.3
5.4
5.5
5.6
5.7
PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Supply Voltage Sequencing and Separation Cautions . .5
3.3.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .5
3.3.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .6
Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pinout—196 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . .12
Pinout—160 QFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .15
ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .16
Oscillator and PLL Electrical Characteristics . . . . . . . .17
External Interface Timing Characteristics . . . . . . . . . . .18
5.6.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
MCF537x ColdFire
Table of Contents
®
Microprocessor Data Sheet, Rev. 4
6
7
8
5.8
5.9
5.10 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.11 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 28
5.12 I
5.13 Fast Ethernet AC Timing Specifications . . . . . . . . . . . 31
5.14 32-Bit Timer Module Timing Specifications . . . . . . . . . 33
5.15 QSPI Electrical Specifications . . . . . . . . . . . . . . . . . . . 33
5.16 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 34
5.17 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 36
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7.1
7.2
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
5.7.1 SDR SDRAM AC Timing Characteristics . . . . . 21
5.7.2 DDR SDRAM AC Timing Characteristics . . . . . 23
General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . 26
Reset and Configuration Override Timing . . . . . . . . . . 27
5.13.1 MII Receive Signal Timing . . . . . . . . . . . . . . . . 31
5.13.2 MII Transmit Signal Timing . . . . . . . . . . . . . . . . 31
5.13.3 MII Async Inputs Signal Timing . . . . . . . . . . . . 32
5.13.4 MII Serial Management Channel Timing . . . . . 32
Package Dimensions—196 MAPBGA . . . . . . . . . . . . . 40
Package Dimensions—160 QFP . . . . . . . . . . . . . . . . . 41
2
C Input/Output Timing Specifications . . . . . . . . . . . . 29
Freescale Semiconductor