MC9S12XET256MAG Freescale Semiconductor, MC9S12XET256MAG Datasheet - Page 28

• Manufacturer Part Number: MC9S12XET256MAG
• Description: MCU 16BIT 256K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XET256MAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-LQFP
• No. Of I/o's: 119
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 25
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 1 Device Overview MC9S12XE-Family
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Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
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16-Bit CPU12X
— Upward compatible with MC9S12 instruction set with the exception of five Fuzzy instructions
— Enhanced indexed addressing
— Access to large data segments independent of PPAGE
INT (interrupt module)
— Eight levels of nested interrupts
— Flexible assignment of interrupt sources to each interrupt level.
— External non-maskable high priority interrupt (XIRQ)
— Internal non-maskable high priority Memory Protection Unit interrupt
— Up to 24 pins on ports J, H and P configurable as rising or falling edge sensitive interrupts
EBI (external bus interface)(available in 208-Pin and 144-Pin packages only)
— Up to four chip select outputs to select 16K, 1M, 2M and up to 4MByte address spaces
— Each chip select output can be configured to complete transaction on either the time-out of one
MMC (module mapping control)
DBG (debug module)
— Monitoring of CPU and/or XGATE busses with tag-type or force-type breakpoint requests
— 64 x 64-bit circular trace buffer captures change-of-flow or memory access information
BDM (background debug mode)
MPU (memory protection unit)
— 8 address regions definable per active program task
— Address range granularity as low as 8-bytes
— No write / No execute Protection Attributes
— Non-maskable interrupt on access violation
XGATE
— Programmable, high performance I/O coprocessor module
— Transfers data to or from all peripherals and RAM without CPU intervention or CPU wait states
— Performs logical, shifts, arithmetic, and bit operations on data
— Can interrupt the HCS12X CPU signalling transfer completion
— Triggers from any hardware module as well as from the CPU possible
— Two interrupt levels to service high priority tasks
— Hardware support for stack pointer initialisation
OSC_LCP (oscillator)
— Low power loop control Pierce oscillator utilizing a 4MHz to 16MHz crystal
— Good noise immunity
— Full-swing Pierce option utilizing a 2MHz to 40MHz crystal
— Transconductance sized for optimum start-up margin for typical crystals
IPLL (Internally filtered, frequency modulated phase-locked-loop clock generation)
(MEM, WAV, WAVR, REV, REVW) which have been removed
of the two wait state generators or the deassertion of EWAIT signal
MC9S12XE-Family Reference Manual , Rev. 1.23
Freescale Semiconductor