MC9S08GB32ACFUE Freescale Semiconductor, MC9S08GB32ACFUE Datasheet - Page 21
MC9S08GB32ACFUE
Manufacturer Part Number
MC9S08GB32ACFUE
Description
IC MCU 32K FLASH 2K RAM 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08GT60ACFDER.pdf
(302 pages)
Specifications of MC9S08GB32ACFUE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
56
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08GB
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
8
Operating Supply Voltage
0 V to 1.8 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
M68EVB908GB60E, M68DEMO908GB60E
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Total Internal Ram Size
2KB
# I/os (max)
56
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8/2.08V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08GB32ACFUE
Manufacturer:
FREESCALE
Quantity:
319
Company:
Part Number:
MC9S08GB32ACFUE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Table 1-2
1.4
Some of the modules inside the MCU have clock source choices.
connection diagram. The ICG supplies the clock sources:
Freescale Semiconductor
•
Control bits inside the ICG determine which source is connected.
ICG
ICGOUT is an output of the ICG module. It is one of the following:
— The external crystal oscillator
— An external clock source
— The output of the digitally-controlled oscillator (DCO) in the frequency-locked loop
System Clock Distribution
lists the functional versions of the on-chip modules.
sub-module
ICGLCLK*
ICGERCLK
FFE
ICGOUT
* ICGLCLK is the alternate BDC clock source for the MC9S08GBxxA/GTxxA.
CPU
÷
CONTROL
2
SYSTEM
LOGIC
÷
2
Figure 1-2. System Clock Distribution Diagram
FIXED FREQ CLOCK (XCLK)
Serial Communications Interface (SCI)
Timer Pulse-Width Modulator (TPM)
Analog-to-Digital Converter (ATD)
Serial Peripheral Interface (SPI)
Internal Clock Generator (ICG)
Central Processing Unit (CPU)
RTI
BUSCLK
Inter-Integrated Circuit (IIC)
Keyboard Interrupt (KBI)
MC9S08GB60A Data Sheet, Rev. 2
Table 1-2. Block Versions
Module
BDC
TPM1
TPM2
ATD has min and max
frequency requirements. See
Chapter 1, “Device
Appendix A, “Electrical
Figure 1-2
IIC1
Version
ATD1
3
2
1
1
1
3
1
2
SCI1
shows a simplified clock
Overview” and
Characteristics.
RAM
Chapter 1 Device Overview
SCI2
Flash has frequency
requirements for program
and erase operation.
See
Characteristics.
Appendix A, “Electrical
FLASH
SPI1
21
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