MC9S08QE128CLH Freescale Semiconductor, MC9S08QE128CLH Datasheet - Page 36

• Manufacturer Part Number: MC9S08QE128CLH
• Description: IC MCU 8BIT 128K FLASH 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE128CLH

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 22x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: S08QE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 50.33 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOQE128, EVBQE128
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 22-ch x 12-bit
• For Use With: EVBQE128 - BOARD EVAL FLEXIS QE128 FAMILYDEMOQE128 - DEMO BOARD FOR QE128 FLEXIS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package Information
36
SEATING
PLANE
–H–
–T–
–L–
DATE 09/21/95
0.05 (0.002)
20
1
4X
C
80
21
3X
0.20 (0.008) H
Figure 26. 80-pin LQFP Package Drawing (Case 917A, Doc #98ASS23237W)
VIEW Y
S1
C2
A1
S
C1
(W)
VIEW AA
A
S
L–M
–N–
N
(Z)
8X
(K)
E
2
1
MC9S08QE128 Series Data Sheet, Rev. 7
2X R
40
61
R1
4X 20 TIPS
60
41
–M–
0.20 (0.008) T
B1
VIEW AA
CASE 917A-02
0.25 (0.010)
V1
0.10 (0.004) T
ISSUE C
GAGE
PLANE
B
V
L–M
N
NOTES:
C L
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –H–.
SEATING PLANE –T–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.460
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A1
B1
C1
C2
R1
S1
V1
01
02
G
W
A
B
C
D
E
F
J
K
P
S
U
V
Z
0
0.13 (0.005)
AB
AB
ROTATED 90 CLOCKWISE
MILLIMETERS
MIN
0.04
1.30
0.22
0.40
0.17
0.09
0.10
0.09
–––
J
14.00 BSC
14.00 BSC
0.325 BSC
16.00 BSC
16.00 BSC
SECTION AB–AB
7.00 BSC
7.00 BSC
0.65 BSC
0.50 REF
8.00 BSC
8.00 BSC
0.20 REF
1.00 REF
0
0
9
Í Í Í Í
Ç Ç Ç
Í Í Í Í
Ç Ç Ç
PLATING
MAX
1.60
0.24
1.50
0.38
0.75
0.33
0.27
0.20
0.16
10
–––
14
VIEW Y
M
F
D
0.002
0.051
0.009
0.016
0.007
0.004
0.004
0.004
Freescale Semiconductor
MIN
T
–––
0.551 BSC
0.276 BSC
0.551 BSC
0.276 BSC
0.026 BSC
0.020 REF
0.013 REF
0.630 BSC
0.315 BSC
0.630 BSC
0.315 BSC
0.008 REF
0.039 REF
0
0
9
INCHES
L–M
G
U
MAX
0.063
0.009
0.059
0.015
0.030
0.013
0.011
0.008
0.006
10
–––
14
S
–X–
X= L, M, N
METAL
BASE
N
P
S