MC9S08RE16CFDER Freescale Semiconductor, MC9S08RE16CFDER Datasheet - Page 214

IC MCU 16K FLASH 1K RAM 48-QFN

MC9S08RE16CFDER

Manufacturer Part Number
MC9S08RE16CFDER
Description
IC MCU 16K FLASH 1K RAM 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08RE16CFDER

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN
Processor Series
S08RE
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08RG60E
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details
Electrical Characteristics
A.9.3
Table A-11
214
and
SPI Timing
External clock frequency
External clock period
External clock high time
External clock low time
Input capture pulse width
Figure A-11
TPM1CHn
Function
through
TPM1CHn
TPM1CHn
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Figure A-10. Timer Input Capture Pulse
Figure A-9. Timer External Clock
Figure A-14
Table A-10. TPM Input Timing
t
clkh
Symbol
f
t
describe the timing requirements for the SPI system.
TPMext
TPMext
t
ICPW
t
t
t
t
clkh
clkl
ICPW
ICPW
t
Text
t
clkl
Min
1.5
1.5
1.5
dc
4
f
Max
Bus
/4
Freescale Semiconductor
MHz
Unit
t
t
t
t
cyc
cyc
cyc
cyc

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