MC9S08QE128CFTR Freescale Semiconductor, MC9S08QE128CFTR Datasheet - Page 2
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MC9S08QE128CFTR
Manufacturer Part Number
MC9S08QE128CFTR
Description
MCU 8BIT 128K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08QE128CFTR
Core Processor
HCS08
Core Size
8-Bit
Speed
50MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, PWM, WDT
Number Of I /o
38
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
1
2
3
2
MC9S08QE128 Series Comparison. . . . . . . . . . . . . . . . . . . . .4
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .12
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .12
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .13
ESD Protection and Latch-Up Immunity . . . . . . . . . . . .14
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Supply Current Characteristics . . . . . . . . . . . . . . . . . . .18
External Oscillator (XOSC) Characteristics . . . . . . . . .21
Internal Clock Source (ICS) Characteristics . . . . . . . . .22
MC9S08QE128 Series Data Sheet, Rev. 7
Table of Contents
4
5
6
7
3.11 Analog Comparator (ACMP) Electricals . . . . . . . . . . . 30
3.12 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.13 Flash Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.1
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.10.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.10.2 TPM Module Timing . . . . . . . . . . . . . . . . . . . . . 26
3.10.3 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Device Numbering System . . . . . . . . . . . . . . . . . . . . . 34
Mechanical Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . 35
Freescale Semiconductor