MC9S08JM16CGT Freescale Semiconductor, MC9S08JM16CGT Datasheet - Page 21

MCU 8BIT 16K FLASH 48-QFN

MC9S08JM16CGT

Manufacturer Part Number
MC9S08JM16CGT
Description
MCU 8BIT 16K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08JM16CGT

Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SCI, SPI, USB
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
37
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
48-QFN Exposed Pad
Processor Series
S08JM
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SPI
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
37
Number Of Timers
2
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
Controller Family/series
HCS08
No. Of I/o's
37
Ram Memory Size
1KB
Cpu Speed
48MHz
No. Of Timers
2
Digital Ic Case Style
QFN
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08JM16CGT
Manufacturer:
PIXART
Quantity:
1 001
Part Number:
MC9S08JM16CGT
Manufacturer:
FREESCALE
Quantity:
6 005
Part Number:
MC9S08JM16CGT
Manufacturer:
FREESCALE
Quantity:
6 005
Part Number:
MC9S08JM16CGT
Manufacturer:
FREESCALE
Quantity:
20 000
Table 1-2
1.3
Figure 1-2
inputs as shown. The clock inputs to the modules indicate the clock(s) that are used to drive the module
functions. All memory mapped registers associated with the modules are clocked with BUSCLK.
Freescale Semiconductor
EXTAL
1. The FFCLK is internally synchronized to the bus clock and must not exceed one half of the bus clock frequency.
2. ADC has min. and max. frequency requirements. See
Characteristics,” for details.
3. Flash has frequency requirements for program and erase operation. See
XOSC
1 kHz
MCG
LPO
XTAL
System Clock Distribution
lists the functional versions of the on-chip modules.
shows a simplified clock connection diagram. Some modules in the MCU have selectable clock
MCGFFCLK
LPO clock
MCGERCLK
MCGIRCLK
MCGOUT
MCGLCLK
USB
RAM
÷
÷
Analog Comparator
Analog-to-Digital Converter
Central Processing Unit
IIC Module
Keyboard Interrupt
Multi-Purpose Clock Generator
Real-Time Counter
Serial Communications Interface
8-/16-bit Serial Peripheral Interface
Timer Pulse-Width Modulator
Universal Serial Bus
Debug Module
2
2
USB
BUSCLK
Figure 1-2. System Clock Distribution Diagram
RTC
Table 1-2. Versions of On-Chip Modules
CPU
MC9S08JM16 Series Data Sheet, Rev. 2
COP
TPMCLK
Chapter 10, “Analog-to-Digital Converter
Module
BDC
TPM1
FFCLK
Appendix A, “Electrical
1
TPM2
(ACMP)
(ADC)
(CPU)
(IIC)
(KBI)
(MCG)
(RTC)
(SCI)
(SPI16)
(TPM)
(USB)
(DBG)
IIC
(S08ADC12V1),” and
Characteristics,” for details.
Version
ADC
SCI1
2
1
2
2
2
1
1
4
1
3
1
2
2
RAM
SCI2
Chapter 1 Device Overview
Appendix A, “Electrical
FLASH
SPI1
3
SPI1
21

Related parts for MC9S08JM16CGT