S9S08SG16E1VTL Freescale Semiconductor, S9S08SG16E1VTL Datasheet - Page 19

• Manufacturer Part Number: S9S08SG16E1VTL
• Description: MCU 16K FLASH 28-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08SG16E1VTL

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 28-TSSOP
• Processor Series: S08SG
• Core: HCS08
• Data Bus Width: 8 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Section Number
17.3 On-Chip Debug System (DBG) .................................................................................................... 279
17.4 Register Definition ........................................................................................................................ 283
A.1 Introduction ....................................................................................................................................291
A.2 Parameter Classification.................................................................................................................291
A.3 Absolute Maximum Ratings...........................................................................................................291
A.4 Thermal Characteristics..................................................................................................................293
A.5 ESD Protection and Latch-Up Immunity .......................................................................................295
A.6 DC Characteristics..........................................................................................................................296
A.7 Supply Current Characteristics.......................................................................................................302
A.8 External Oscillator (XOSC) Characteristics ..................................................................................306
A.9 Internal Clock Source (ICS) Characteristics ..................................................................................308
A.10 Analog Comparator (ACMP) Electricals .......................................................................................309
A.11 ADC Characteristics.......................................................................................................................310
A.12 AC Characteristics..........................................................................................................................316
A.13 Flash Specifications........................................................................................................................323
A.14 EMC Performance..........................................................................................................................324
B.1 Ordering Information .....................................................................................................................325
B.2 Package Information and Mechanical Drawings ...........................................................................326
Freescale Semiconductor
17.3.1 Comparators A and B...................................................................................................... 279
17.3.2 Bus Capture Information and FIFO Operation ............................................................... 279
17.3.3 Change-of-Flow Information .......................................................................................... 280
17.3.4 Tag vs. Force Breakpoints and Triggers ......................................................................... 280
17.3.5 Trigger Modes................................................................................................................. 281
17.3.6 Hardware Breakpoints .................................................................................................... 283
17.4.1 BDC Registers and Control Bits ..................................................................................... 283
17.4.2 System Background Debug Force Reset Register (SBDFR) .......................................... 285
17.4.3 DBG Registers and Control Bits..................................................................................... 286
A.12.1 Control Timing ................................................................................................................316
A.12.2 TPM/MTIM Module Timing ...........................................................................................318
A.12.3 SPI....................................................................................................................................319
A.14.1 Radiated Emissions..........................................................................................................324
B.1.1 Device Numbering Scheme .............................................................................................326
Ordering Information and Mechanical Drawings
Electrical Characteristics
MC9S08SG32 Data Sheet, Rev. 8
Appendix A
Appendix B
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