MC9S08JS8LCWJ Freescale Semiconductor, MC9S08JS8LCWJ Datasheet - Page 2

• Manufacturer Part Number: MC9S08JS8LCWJ
• Description: MCU 8BIT 8K FLASH 20-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08JS8LCWJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: LIN, SCI, SPI, USB
• Peripherals: LVD, POR, PWM
• Number Of I /o: 14
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (7.5mm Width)
• Processor Series: S08JS
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 48 MHz
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08JS16
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

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Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will
be the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
The following revision history table summarizes changes contained in this document.
Related Documentation
Find the most current versions of all documents at: http://www.freescale.com
2
Reference Manual
Revision
MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
http://freescale.com/
1
2
3
4
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . .6
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . .6
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .7
Electrostatic Discharge (ESD) Protection Characteristics8
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Supply Current Characteristics . . . . . . . . . . . . . . . . . . .15
External Oscillator (XOSC) Characteristics . . . . . . . . .17
MCG Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .18
4/24/2009
9/1/2008
1/8/2009
3/9/2009
Date
(MC9S08JS16RM)
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
Initial public released
In
RI
Corrected the 24-pin QFN case number and doc. number information.
Added new parts information about MC9S08JS16L and MC9S08JS8L.
DD
Table
were changed as well.
MC9S08JS16 Series MCU Data Sheet, Rev. 4
7, changed the parameter description of RI
Table of Contents
4
Description of Changes
3.9
3.10 SPI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.11 Flash Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.12 USB Electricals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.1
4.2
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.9.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.9.2 Timer/PWM (TPM) Module Timing. . . . . . . . . . 20
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Mechanical Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . 26
DD
and S3I
Freescale Semiconductor
DD,
the typicals of