STM32F107VBT6 STMicroelectronics, STM32F107VBT6 Datasheet - Page 102

MCU ARM 128KB FLASH MEM 100-LQFP

STM32F107VBT6

Manufacturer Part Number
STM32F107VBT6
Description
MCU ARM 128KB FLASH MEM 100-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F107VBT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
80
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F107x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
48 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
80
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
48KB
# I/os (max)
80
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-10064 - EVAL BOARD497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8915

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Revision history
102/104
Table 65.
11-May-2010
01-Aug-2011
Date
Document revision history (continued)
Revision
5
6
Added BGA package.
Table 5: Pin
ETH_RMII_RXD0 and ETH_RMII_RXD1 added in remap column for
PD9 and PD10, respectively.
Note added to ETH_MII_RX_DV, ETH_MII_RXD0, ETH_MII_RXD1,
ETH_MII_RXD2 and ETH_MII_RXD3
Updated
Added
to
Updated
Updated
Updated
Updated
for SMI on page
Updated
for RMII on page 72
Updated
Updated
Changed SRAM size to 64 KB on all parts.
Updated PD0 and PD1 description in
page 26
Updated footnotes below
and
Updated tw min in
characteristics on page 45
Updated startup time in
(fLSE = 32.768 kHz) on page 48
Added
page 55
Updated
Add Interna code V to
page 89
Doc ID 15274 Rev 6
Figure 21: 5 V tolerant I/O input characteristics - TTL port
Table 7: Current characteristics on page 34
Figure 18: Standard I/O input characteristics - CMOS port
Section 5.3.12: I/O current injection characteristics on
Table 36: I/O static characteristics on page 55
Table 43: SPI characteristics on page
Table 44: I2S characteristics on page
Table 48: Ethernet DC electrical characteristics on page
Table 49: Dynamic characteristics: Ethernet MAC signals
Table 50: Dynamic characteristics: Ethernet MAC signals
Figure 55: USB OTG FS + Ethernet solution on page
Figure 56: USB OTG FS + I2S (Audio) solution on page 96
Table 36: I/O static characteristics on page 55
definitions:
71.
Table 20: High-speed external user clock
Table 62: Ordering information scheme on
Table 23: LSE oscillator characteristics
Table 6: Voltage characteristics on page 34
Changes
STM32F105xx, STM32F107xx
Table 5: Pin definitions on
68.
65.
96.
71.

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