STM32F103RBH6 STMicroelectronics, STM32F103RBH6 Datasheet - Page 95
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STM32F103RBH6
Manufacturer Part Number
STM32F103RBH6
Description
MCU ARM 32BIT 128KB FLASH 64BGA
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103R8H6.pdf
(99 pages)
Specifications of STM32F103RBH6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-BGA
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
20 KB
Interface Type
CAN, I2C, SPI, USART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32-JL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ST-LINK
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (12 bit, 16 Channel)
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103RBH6
Manufacturer:
ST
Quantity:
14 000
Company:
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STM32F103RBH6
Manufacturer:
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Manufacturer:
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STM32F103x8, STM32F103xB
Table 60.
22-May-2008
14-Mar-2008
21-Mar-2008
Date
Document revision history (continued)
Revision
5
6
7
Figure 2: Clock tree on page 12
Maximum T
page
CRC feature added (see
unit on page 9
I
Stop and Standby
ACC
note 2 removed.
P
in
t
V
page
Table 42: SPI characteristics on page 69
I
Table 48: ADC accuracy - limited test conditions
accuracy
LQFP100 package specifications updated (see
characteristics on page
Recommended LQFP100, LQFP 64, LQFP48 and VFQFPN36
footprints added (see
Section 6.2: Thermal characteristics on page 88
Section 6.2.1
Appendix A: Important notes on page 81
Small text changes.
In
– N
– cycling conditions specified for t
– t
V
CRC feature removed.
CRC feature added back. Small text changes.
modified.
I
current consumptions in Stop and Standby modes on page
I
Standby mode on page
Values added to
3.3 V) on page
Figure 32: SPI timing diagram - slave mode and CPHA = 0 on page 70
modified.
t
data retention on page
V
Figure 54: LQFP100 PD max vs. TA on page 90
Axx option added to
page
DD
RET
VREF
DD
DD_VBAT
RET
D
NF(NRST)
25
USB
Table 28: Flash memory characteristics on page
Table 29: Flash memory endurance and data
, T
RET
Doc ID 13587 Rev 13
, Avg_Slope and T
modified in
END
at T
HSI
modified in
at T
A
36.
65.
91.
added to
added to
and T
min modified at T
A
modified in
tested over the whole temperature range
A
removed from
max = 105 °C added to
modified.
Section 2.2: Full compatibility throughout the family
Equation 1
= 105 °C modified in
unit corrected in
J
J
value given in
added, t
and
and
Table 16: Typical and maximum current consumptions in
Table 44: USB DC electrical characteristics on page
68.
Table 46: ADC characteristics on page
Table 29: Flash memory endurance and data
Table 41: SCL frequency (fPCLK1= 36 MHz.,VDD =
Section 6.2.2
modes.
Figure 10: Memory map on page 32
Table 24: HSI oscillator characteristics on page
Figure 10: Memory map
Table 59: Ordering information scheme on
corrected.
Figure
prog
L
56.
modified in
Table 21: Typical current consumption in
78).
A
47.
CRC (cyclic redundancy check) calculation
= 55 °C
values modified and t
Table 38: NRST pin characteristics on
Table 8: Thermal characteristics on
47,
Changes
Table 29: Flash memory endurance and
added.
added.
Figure
Table 16: Typical and maximum
RET
Table 50: TS
49,
modified.
removed.
Figure 53
clarified.
Section 1: Introduction
prog
Section 6: Package
retention:
added.
characteristics.
modified.
modified,
55.
description clarified
Revision history
and
73.
Table 49: ADC
for address).
Figure
43.
added.
retention.
41).
95/99
53,
72.