EP7309-CVZ Cirrus Logic Inc, EP7309-CVZ Datasheet - Page 29

• Manufacturer Part Number: EP7309-CVZ
• Description: IC ARM720T MCU 74MHZ 208-LQFP
• Manufacturer: Cirrus Logic Inc
• Series: EP7r

Specifications of EP7309-CVZ

• Core Size: 32-Bit
• Core Processor: ARM7
• Speed: 74MHz
• Connectivity: Codec, DAI, EBI/EMI, IrDA, Keypad, SPI/Microwire1, UART/USART
• Peripherals: LCD, LED, MaverickKey, POR, PWM
• Number Of I /o: 27
• Program Memory Type: ROMless
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 2.7 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 208-LQFP
• Controller Family/series: (ARM7)
• No. Of I/o's: 27
• Ram Memory Size: 48KB
• Cpu Speed: 74MHz
• No. Of Timers: 2
• No. Of Pwm Channels: 2
• Digital Ic Case Style: LQFP
• Embedded Interface Type: SSI, UART
• Rohs Compliant: Yes
• Processor Series: EP73xx
• Core: ARM720T
• Data Bus Width: 32 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 598-1214

204-Ball TFBGA Package Characteristics
204-Ball TFBGA Package Specifications
DS507F1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Y
W
C
1
A1 CORNER
2
3
4
5
TOP VIEW
6
SEATING PLANE
7
8
9 10 11
12 13
14 15
16
17
©
Figure 13. 204-Ball TFBGA Package
18
Copyright Cirrus Logic, Inc. 2005
19 20
(All Rights Reserved)
A
B
Ø0.25~0.35(204X)
Ø0.15 M C A
20
High-Performance, Low-Power System on Chip
19 18 17 16 15 14 13 12 11 10 9
B
Ball Pitch :
Ball Diam eter :
BOTTOM VIEW
13±0.05
12.35
0.65
0.3
8
Substrate Thickness :
Mold Thickness
7
A1 CORNER
6
5
0.65
:
4
3
2
EP7309
1
0.36
0.53
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
29