DSPIC30F6013T-20E/PF Microchip Technology, DSPIC30F6013T-20E/PF Datasheet - Page 227
DSPIC30F6013T-20E/PF
Manufacturer Part Number
DSPIC30F6013T-20E/PF
Description
IC DSPIC MCU/DSP 132K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F6014-20IPF.pdf
(228 pages)
2.DSPIC30F6014-20IPF.pdf
(22 pages)
3.DSPIC30F6014-20IPF.pdf
(28 pages)
Specifications of DSPIC30F6013T-20E/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TQFP, 80-VQFP
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F6013T20EP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6013T-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F6014-20IPF PDF datasheet
- DSPIC30F6014-20IPF PDF datasheet #2
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PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2006 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F6011AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 6 0 11 AT - 3 0 I / P F - E S
dsPIC30F6011/6012/6013/6014
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
PF = TQFP 14x14
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70117F-page 225
Speed
20 = 20 MIPS
30 = 30 MIPS
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