PIC16CE623/JW Microchip Technology, PIC16CE623/JW Datasheet - Page 99
![IC MCU EPROM512X14 EE COMP18CDIP](/photos/12/13/121351/150-18-cdip_sml.jpg)
PIC16CE623/JW
Manufacturer Part Number
PIC16CE623/JW
Description
IC MCU EPROM512X14 EE COMP18CDIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16CE623-04P.pdf
(113 pages)
Specifications of PIC16CE623/JW
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
896B (512 x 14)
Program Memory Type
EPROM, UV
Eeprom Size
128 x 8
Ram Size
96 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
18-CDIP (0.300", 7.62mm) Window
For Use With
DVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Data Converters
-
Connectivity
-
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20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
1999 Microchip Technology Inc.
JEDEC Equivalent: MO-150
Drawing No. C04-072
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
*Controlling Parameter
c
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
p
n
Dimension Limits
E1
E
Units
A2
A1
E1
E
D
B
n
p
A
L
c
MIN
2
1
.068
.064
.002
.299
.278
.022
.004
.010
.201
0
0
0
D
L
INCHES*
NOM
.026
.073
.068
.006
.309
.207
.284
.030
.007
.013
20
A1
4
5
5
A
MAX
.078
.072
.010
.322
.212
.289
.037
.010
.015
10
10
8
MIN
1.73
1.63
0.05
7.59
7.06
0.56
0.10
0.00
0.25
5.11
PIC16CE62X
0
0
MILLIMETERS
NOM
101.60
0.66
1.85
1.73
0.15
7.85
5.25
7.20
0.75
0.18
0.32
20
5
5
DS40182C-page 99
MAX
203.20
A2
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
0.38
10
10
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