PIC18C858-E/PT Microchip Technology, PIC18C858-E/PT Datasheet - Page 346

• Manufacturer Part Number: PIC18C858-E/PT
• Description: IC MCU OTP 16KX16 CAN 80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Cr

Specifications of PIC18C858-E/PT

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: OTP
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-TFQFP
• Processor Series: PIC18C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1536 B
• Interface Type: 3-Wire, I2C, SPI, USART, CAN
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 68
• Number Of Timers: 4 bit
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: ICE2000, DM163007, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6
• Data Rom Size: 4 KB
• Height: 1 mm
• Length: 12 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.2 V
• Width: 12 mm
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC18C858E/PT

PIC18CXX8
68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30475A-page 346
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
n
E2
E1
Dimension Limits
E
1
2
CH1 x 45
Units
CH1
CH2
A2
A1
A3
E1
D1
E2
D2
B1
n1
n
A
E
D
B
p
c
Advanced Information
D1
MIN
D
A2
.165
.145
.020
.024
.040
.000
.985
.985
.950
.950
.890
.890
.008
.026
.013
0
0
32
INCHES*
NOM
A
.045
.005
.050
.173
.153
.028
.029
.990
.990
.954
.954
.920
.920
.011
.029
.020
68
17
5
5
A3
MAX
.180
.160
.035
.034
.050
.010
.995
.995
.958
.958
.930
.930
.013
.032
.021
10
10
B1
B
MIN
24.13
24.13
25.02
25.02
22.61
22.61
4.19
3.68
0.51
0.61
1.02
0.00
0.20
0.66
0.33
D2
0
0
MILLIMETERS
p
NOM
2000 Microchip Technology Inc.
25.15
25.15
24.23
24.23
23.37
23.37
1.27
4.39
3.87
0.71
0.74
1.14
0.13
0.27
0.74
0.51
68
17
5
5
A1
MAX
25.27
25.27
24.33
24.33
23.62
23.62
4.06
0.89
4.57
0.86
1.27
0.25
0.33
0.81
0.53
10
10