PIC18F8622-I/PT Microchip Technology, PIC18F8622-I/PT Datasheet - Page 431

• Manufacturer Part Number: PIC18F8622-I/PT
• Description: IC PIC MCU FLASH 32KX16 80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F8622-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (32K x 16)
• Package / Case: 80-TFQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 70
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3936 B
• Interface Type: SPI/I2C/EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX E:
A detailed discussion of the differences between the
mid-range MCU devices (i.e., PIC16CXXX) and the
enhanced devices (i.e., PIC18FXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to
PIC18C442”. The changes discussed, while device
specific, are generally applicable to all mid-range to
enhanced device migrations.
This Application Note is available on our web site,
www.microchip.com, as Literature Number DS00716.
 2004 Microchip Technology Inc.
MIGRATION FROM
MID-RANGE TO
ENHANCED DEVICES
Preliminary
APPENDIX F:
A detailed discussion of the migration pathway and
differences between the high-end MCU devices (i.e.,
PIC17CXXX)
PIC18FXXX) is provided in AN726, “PIC17CXXX to
PIC18CXXX Migration”.
This Application Note is available on our web site,
www.microchip.com, as Literature Number DS00726.
PIC18F8722 FAMILY
and
the
MIGRATION FROM
HIGH-END TO
ENHANCED DEVICES
enhanced
DS39646B-page 429
devices
(i.e.,