ATSAM3S2AA-MU Atmel, ATSAM3S2AA-MU Datasheet - Page 10

IC MCU 32BIT 128KB FLASH 48QFN

ATSAM3S2AA-MU

Manufacturer Part Number
ATSAM3S2AA-MU
Description
IC MCU 32BIT 128KB FLASH 48QFN
Manufacturer
Atmel
Series
SAM3Sr
Datasheets

Specifications of ATSAM3S2AA-MU

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
64MHz
Connectivity
I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
34
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 1.95 V
Data Converters
A/D 8x10/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
Processor Series
ATSAM3x
Core
ARM Cortex M3
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3S-EK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
4. Package and Pinout
4.1
4.1.1
4.1.2
10
SAM3S4/2/1C Package and Pinout
SAM3S Summary
100-lead LQFP Package Outline
100-ball LFBGA Package Outline
Figure 4-2
Figure 4-1.
The 100-Ball LFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimen-
sions are 9 x 9 x 1.1 mm.
Figure 4-2.
shows the orientation of the 100-ball LFBGA Package
Orientation of the 100-lead LQFP Package
Orientation of the 100-BALL LFBGA Package
100
76
BALL A1
10
9
8
7
6
5
4
2
3
1
75
A B C D E F G H J K
1
TOP VIEW
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25
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6500CS–ATARM–24-Jan-11

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