PIC18F6621-E/PT Microchip Technology, PIC18F6621-E/PT Datasheet - Page 32
![IC PIC MCU FLASH 32KX16 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC18F6621-E/PT
Manufacturer Part Number
PIC18F6621-E/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F6525-IPT.pdf
(396 pages)
3.PIC18F6525-IPT.pdf
(8 pages)
4.PIC18F6525-IPT.pdf
(38 pages)
Specifications of PIC18F6621-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
MSSP, SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
2 x 8 bit
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F6621-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC18F6X2X/8X2X
5.4
To allow portability of code, a PIC18F6X2X/8X2X pro-
grammer is required to read the configuration word
locations from the HEX file. If configuration word infor-
mation is not present in the HEX file, then a simple
warning message should be issued. Similarly, while
saving a HEX file, all configuration word information
must be included. An option to not include the configu-
ration word information may be provided. When
embedding configuration word information in the HEX
file, it should start at address 300000h.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
5.5
To allow portability of code, a PIC18F6X2X/8X2X pro-
grammer is required to read the data EEPROM infor-
mation from the HEX file. If data EEPROM information
is not present, a simple warning message should be
issued. Similarly, when saving a HEX file, all data
EEPROM information must be included. An option to
not include the data EEPROM information may be pro-
vided. When embedding data EEPROM information in
the HEX file, it should start at address F00000h.
Microchip Technology Inc. believes that this feature is
important for the benefit of the end customer.
DS30499B-page 32
Embedding Configuration Word
Information in the HEX File
Embedding Data EEPROM
Information In the HEX File
5.6
The checksum is calculated by summing the following:
• The contents of all code memory locations
• The configuration word, appropriately masked
• ID locations
The Least Significant 16 bits of this sum are the
checksum.
Table 5-4 (pages 33 through 34) describes how to
calculate the checksum for each device.
Note:
Checksum Computation
The checksum calculation differs depend-
ing on the code protect setting. Since the
code memory locations read out differently
depending on the code protect setting, the
table describes how to manipulate the
actual code memory values to simulate
the values that would be read from a pro-
tected device. When calculating a check-
sum by reading a device, the entire code
memory can simply be read and summed.
The configuration word and ID locations
can always be read.
2003 Microchip Technology Inc.