PIC18F452-E/P Microchip Technology, PIC18F452-E/P Datasheet - Page 13
![IC MCU CMOS 40MHZ 16K FLSH 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F452-E/P
Manufacturer Part Number
PIC18F452-E/P
Description
IC MCU CMOS 40MHZ 16K FLSH 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F242-ISO.pdf
(332 pages)
3.PIC18F242-ISO.pdf
(14 pages)
4.PIC18F242-ISO.pdf
(16 pages)
5.PIC18F242-ISO.pdf
(16 pages)
6.PIC18F242-ISO.pdf
(14 pages)
7.PIC18LF242-ISO.pdf
(36 pages)
8.PIC18F452-EP.pdf
(332 pages)
Specifications of PIC18F452-E/P
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
34
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP/SPI/I2C/PSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F452-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC18FXX2
REVISION HISTORY
Rev A Document (10/2003)
First revision of this document. Listed silicon issues
1 (Core – Program Memory Space), 2 (Data
EEPROM), 3 and 4 (MSSP) and 5 (Core – Instruction
Set) and data sheet clarification issues 1 (DC
Characteristics), 2 (Low-Voltage Detect
Characteristics) and 3 (Packaging – Pinout and
Product Identification).
Rev B Document (05/2005)
Added silicon issue 6 (Reset).
Rev C Document (08/2005)
Moved silicon issue 4 (MSSP) to MSSP module errata
and added silicon issue 6 (Program Memory).
© 2005 Microchip Technology Inc.
DS80173C-page 13