PIC16F77-I/P Microchip Technology, PIC16F77-I/P Datasheet - Page 11
![IC MCU FLASH 8KX14 A/D 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F77-I/P
Manufacturer Part Number
PIC16F77-I/P
Description
IC MCU FLASH 8KX14 A/D 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F77-I/P
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F77-I/P
Manufacturer:
AVX
Quantity:
84 000
Company:
Part Number:
PIC16F77-I/P
Manufacturer:
MICROCHI
Quantity:
2 000
Company:
Part Number:
PIC16F77-I/PT
Manufacturer:
ADDTEK
Quantity:
20 000
Company:
Part Number:
PIC16F77-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F77-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
FIGURE 4:
2003 Microchip Technology Inc.
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
A1
Number of Pins
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Lead Width
Lead Length
Drawing No. C04-103
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: M0-220
*Controlling Parameter
Notes:
44-PIN QFN PACKAGE (DRAWING 1, PACKAGING)
OPTIONAL PIN 1
TOP MARKING
INDEX ON
TOP VIEW
Dimension Limits
E
Units
D2
A1
A3
E2
D
n
p
A
E
B
L
n
MIN
2
1
EXPOSED PAD
.031
.000
.262
.262
.012
.014
A3
D
INDEX ON
A
INCHES
.026 BSC
.315 BSC
.315 BSC
.010 REF
PIN 1
NOM
D2
.035
.001
.268
.268
.013
.016
44
PIC16F73/74/76/77
EXPOSED
MAX
.039
.002
.274
.274
.013
.018
METAL
BOTTOM VIEW
PAD
MIN
E2
0.80
6.65
6.65
0.30
0.35
0
MILLIMETERS*
0.65 BSC
8.00 BSC
8.00 BSC
0.25 REF
NOM
0.90
0.02
6.80
6.80
0.33
0.40
44
DS80099G-page 11
L
MAX
p
B
1.00
0.05
6.95
6.95
0.35
0.45