ATXMEGA128A1-C7U Atmel, ATXMEGA128A1-C7U Datasheet - Page 2
![MCU AVR 128K FLASH 1.6V 100VFBGA](/photos/12/32/123223/100-lfbga_sml.jpg)
ATXMEGA128A1-C7U
Manufacturer Part Number
ATXMEGA128A1-C7U
Description
MCU AVR 128K FLASH 1.6V 100VFBGA
Manufacturer
Atmel
Series
AVR® XMEGAr
Datasheet
1.ATAVRONEKIT.pdf
(113 pages)
Specifications of ATXMEGA128A1-C7U
Core Processor
AVR
Core Size
8/16-Bit
Speed
32MHz
Connectivity
EBI/EMI, I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
78
Program Memory Size
128KB (64K x 16)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 3.6 V
Data Converters
A/D 16x12b, D/A 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-VFBGA
Processor Series
XMEGA
Core
AVR
Data Bus Width
8 bit, 16 bit
Data Ram Size
8 KB
Interface Type
SPI, TWI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
78
Number Of Timers
8
Operating Supply Voltage
2.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT, ATQT600
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
1. Ordering Information
Notes:
8067M–AVR–09/10
100A
100C1
100C2
Ordering Code
ATxmega384A1-AU
ATxmega256A1-AU
ATxmega192A1-AU
ATxmega128A1-AU
ATxmega64A1-AU
ATxmega384A1-CU
ATxmega256A1-CU
ATxmega192A1-CU
ATxmega128A1-CU
ATxmega64A1-CU
ATxmega128A1-C7U
ATxmega64A1-C7U
1.
2.
3.
This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.
Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
For packaging information, see
100-lead, 14 x 14 x 1.0 mm, 0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.88 mm, Chip Ball Grid Array (CBGA)
100-ball, 7 x 7 x 1.0 mm Body, Ball Pitch 0.65 mm, Very Thin Fine-Pitch Ball Grid Array (VFBGA)
‘
384K + 8K
256K + 8K
192K + 8K
128K + 8K
384K + 8K
256K + 8K
192K + 8K
128K + 8K
128K + 8K
Flash (B)
64K + 4K
64K + 4K
64K + 4K
“Packaging information” on page
4 KB
4 KB
2 KB
2 KB
2 KB
4 KB
4 KB
2 KB
2 KB
2 KB
2 KB
2 KB
E
2
Package Type
SRAM
64.
32 KB
16 KB
16 KB
32 KB
16 KB
16 KB
8 KB
4 KB
8 KB
4 KB
8 KB
4 KB
Speed (MHz)
32
32
32
32
32
32
32
32
32
32
32
32
Power Supply
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
1.6 - 3.6V
Package
100C1
100C2
100A
XMEGA A1
(1)(2)(3)
-40°C - 85°C
Temp
2