PIC18F2520-I/ML Microchip Technology, PIC18F2520-I/ML Datasheet - Page 7

• Manufacturer Part Number: PIC18F2520-I/ML
• Description: IC PIC MCU FLASH 16KX16 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2520-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit
• Package: 28QFN EP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Data Rom Size: 256 KB
• Height: 0.88 mm
• Length: 6 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.2 V
• Width: 6 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP3909RD-3PH1 - REF DESIGN MCP3909 3PH ENGY MTRXLT28QFN4 - SOCKET TRANS ICE 28QFN W/CABLEAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 105
11.0 Timer0 Module ......................................................................................................................................................................... 123
12.0 Timer1 Module ......................................................................................................................................................................... 127
13.0 Timer2 Module ......................................................................................................................................................................... 133
14.0 Timer3 Module ......................................................................................................................................................................... 135
15.0 Capture/Compare/Pwm (CCP) Modules .................................................................................................................................. 139
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 147
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 161
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 201
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 223
20.0 Comparator Module.................................................................................................................................................................. 233
21.0 Comparator Voltage Reference Module................................................................................................................................... 239
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 243
23.0 Special Features of the CPU.................................................................................................................................................... 249
24.0 Instruction Set Summary .......................................................................................................................................................... 267
25.0 Development Support............................................................................................................................................................... 317
26.0 Electrical Characteristics .......................................................................................................................................................... 323
27.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 361
28.0 Packaging Information.............................................................................................................................................................. 363
Appendix A: Revision History............................................................................................................................................................. 371
Appendix B: Device Differences ........................................................................................................................................................ 371
Appendix C: Conversion Considerations ........................................................................................................................................... 372
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 372
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 373
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 373
Index .................................................................................................................................................................................................. 375
On-Line Support................................................................................................................................................................................. 385
Systems Information and Upgrade Hot Line ...................................................................................................................................... 385
Reader Response .............................................................................................................................................................................. 386
PIC18F2420/2520/4420/4520 Product Identification System ............................................................................................................ 387
 2004 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 53
Flash Program Memory.............................................................................................................................................................. 73
Data EEPROM Memory ............................................................................................................................................................. 83
8 x 8 Hardware Multiplier............................................................................................................................................................ 89
Interrupts .................................................................................................................................................................................... 91
PIC18F2420/2520/4420/4520
Preliminary
DS39631A-page 5