PIC16C63-04I/SP Microchip Technology, PIC16C63-04I/SP Datasheet - Page 294

• Manufacturer Part Number: PIC16C63-04I/SP
• Description: IC MCU OTP 4KX14 PWM 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C63-04I/SP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3 bit
• Operating Supply Voltage: 4 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• For Use With: DVMCPA - KIT DVR BOARD EVAL SYSTEM MXDEV1
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

PIC16C6X
25.4
DS30234D-page 294
Symbol
Chamfer
h x 45
Seating
Plane
CP
A1
C
D
H
N
A
B
E
e
h
L
Index
Area
18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body) (SO)
CP
A1
11.353
10.007
N
2.362
0.101
0.355
0.241
7.416
1.270
0.381
0.406
B
1
Min
18
0
–
A
2
3
Millimeters
11.735
10.643
2.642
0.300
0.483
0.318
7.595
1.270
0.762
1.143
0.102
Max
Package Group: Plastic SOIC (SO)
18
8
D
e
Reference
Notes
E
H
Base
Plane
0.093
0.004
0.014
0.009
0.447
0.292
0.050
0.394
0.015
0.016
Min
18
0
–
h x 45
Inches
1997 Microchip Technology Inc.
0.050
0.104
0.012
0.019
0.013
0.462
0.299
0.419
0.030
0.045
0.004
Max
18
8
L
Reference
Notes
C