PIC24FJ192GB110T-I/PF Microchip Technology, PIC24FJ192GB110T-I/PF Datasheet - Page 312
![IC PIC MCU FLASH 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC24FJ192GB110T-I/PF
Manufacturer Part Number
PIC24FJ192GB110T-I/PF
Description
IC PIC MCU FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA106-IPT.pdf
(52 pages)
2.PIC24FJ64GB106-IPT.pdf
(16 pages)
3.PIC24FJ64GB106-IPT.pdf
(352 pages)
Specifications of PIC24FJ192GB110T-I/PF
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
83
Program Memory Size
192KB (65.5K x 24)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
84
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
PIC24FJ192GB110T-I/PFTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ192GB110T-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24FJ128GA106-IPT PDF datasheet
- PIC24FJ64GB106-IPT PDF datasheet #2
- PIC24FJ64GB106-IPT PDF datasheet #3
- Current page: 312 of 352
- Download datasheet (3Mb)
PIC24FJ256GB110 FAMILY
29.1
FIGURE 29-1:
TABLE 29-1:
TABLE 29-2:
DS39897C-page 312
PIC24FJ256GB110 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 14x14x1 mm TQFP
Package Thermal Resistance, 12x12x1 mm TQFP
Package Thermal Resistance, 10x10x1 mm TQFP
Package Thermal Resistance, 9x9x0.9 mm QFN
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
For frequencies between 16 MHz and 32 MHz, F
Note 1:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
When the voltage regulator is disabled, V
V
x (I
DD
DDCORE
3.00V
2.75V
2.50V
2.25V
2.00V
PIC24FJ256GB110 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– I
OH
V
} x I
Rating
OH
DD
OH
)
16 MHz
3.6V.
) + (V
OL
x I
OL
PIC24FJXXXGB1XX
)
Frequency
MAX
JA
DD
(
= (64 MHz/V) * (V
JA
and V
) numbers are achieved by package simulations.
Symbol
Symbol
P
DDCORE
DMAX
P
T
T
JA
JA
JA
JA
A
D
J
must be maintained so that
DDCORE
50.0
69.4
76.6
28.0
Min
Typ
-40
-40
(T
2009 Microchip Technology Inc.
P
32 MHz
– 2V) + 16 MHz.
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/
2.75V
2.25V
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W
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