PIC24FJ192GB110-I/PT Microchip Technology, PIC24FJ192GB110-I/PT Datasheet - Page 44
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PIC24FJ192GB110-I/PT
Manufacturer Part Number
PIC24FJ192GB110-I/PT
Description
IC PIC MCU FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA106-IPT.pdf
(52 pages)
2.PIC24FJ64GB106-IPT.pdf
(16 pages)
3.PIC24FJ64GB106-IPT.pdf
(352 pages)
4.PIC24FJ192GB108-IPT.pdf
(328 pages)
Specifications of PIC24FJ192GB110-I/PT
Program Memory Type
FLASH
Program Memory Size
192KB (65.5K x 24)
Package / Case
100-TFQFP
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
83
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
84
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240011 - KIT STARTER MPLAB FOR PIC24F MCUMA240014 - MODULE PLUG-IN PIC24
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ192GB110-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC24FJXXXGA1/GB1
TABLE 5-5:
DS39907A-page 44
Step 15: Set the Read Pointer (W6) and load the (next four write) latches.
Step 16: Repeat Steps 14-15, sixteen times, to load the write latches for the 64 instructions.
Step 17: Initiate the programming cycle.
Step 18: Repeat this step to poll the WR bit (bit 15 of NVMCON) until it is cleared by the hardware.
Step 19: Reset the device internal PC.
Step 20: Repeat Steps 14-19 until all 16 rows of executive memory have been programmed. On the final row, make
Command
(Binary)
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0001
0000
0000
0000
sure to initialize the write latches at the Diagnostic and Calibration Words locations with 0xFFFFFF to
ensure that the calibration is not overwritten.
PROGRAMMING THE PROGRAMMING EXECUTIVE (CONTINUED)
EB0300
000000
BB0BB6
000000
000000
BBDBB6
000000
000000
BBEBB6
000000
000000
BB1BB6
000000
000000
BB0BB6
000000
000000
BBDBB6
000000
000000
BBEBB6
000000
000000
BB1BB6
000000
000000
A8E761
000000
000000
040200
000000
803B02
883C22
000000
<VISI>
000000
040200
000000
(Hex)
Data
CLR
NOP
TBLWTL
NOP
NOP
TBLWTH.B [W6++], [W7++]
NOP
NOP
TBLWTH.B [W6++], [++W7]
NOP
NOP
TBLWTL
NOP
NOP
TBLWTL
NOP
NOP
TBLWTH.B [W6++], [W7++]
NOP
NOP
TBLWTH.B [W6++], [++W7]
NOP
NOP
TBLWTL
NOP
NOP
BSET
NOP
NOP
GOTO
NOP
MOV
MOV
NOP
Clock out contents of the VISI register.
NOP
GOTO
NOP
W6
[W6++], [W7]
[W6++], [W7++]
[W6++], [W7]
[W6++], [W7++]
NVMCON, #15
0x200
NVMCON, W2
W2, VISI
0x200
Description
© 2007 Microchip Technology Inc.