PIC16LF73-I/ML Microchip Technology, PIC16LF73-I/ML Datasheet - Page 160
![IC PIC MCU FLASH 4KX14 28QFN](/photos/6/81/68120/150-28-qfn_sml.jpg)
PIC16LF73-I/ML
Manufacturer Part Number
PIC16LF73-I/ML
Description
IC PIC MCU FLASH 4KX14 28QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16LF73-I/ML
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
192 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Package
28QFN EP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
PIC16LF73I/ML
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16LF73-I/ML
Manufacturer:
Microchip Technology
Quantity:
135
PIC16F7X
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
DS30325B-page 158
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
eB
A1
E1
B1
E
D
B
n
p
A
L
c
A
A1
MIN
2.045
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
40
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
13.46
51.94
15.75
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
NOM
2002 Microchip Technology Inc.
15.24
13.84
52.26
16.51
4.45
2.54
3.30
0.29
1.27
0.46
3.81
40
10
10
p
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15