PIC24FJ96GA010-I/PF Microchip Technology, PIC24FJ96GA010-I/PF Datasheet - Page 219

IC PIC MCU FLASH 48KX16 100TQFP

PIC24FJ96GA010-I/PF

Manufacturer Part Number
PIC24FJ96GA010-I/PF
Description
IC PIC MCU FLASH 48KX16 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr

Specifications of PIC24FJ96GA010-I/PF

Core Size
16-Bit
Program Memory Size
96KB (32K x 24)
Oscillator Type
Internal
Core Processor
PIC
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
84
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Controller Family/series
PIC24
No. Of I/o's
84
Ram Memory Size
8192Byte
Cpu Speed
32MHz
No. Of Timers
5
No.
RoHS Compliant
Embedded Interface Type
EUART, I2C, PSP, SPI
Rohs Compliant
Yes
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
84
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011, DV164033, AC164127, MA240011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240011 - KIT STARTER MPLAB FOR PIC24F MCUDV164033 - KIT START EXPLORER 16 MPLAB ICD2MA160011 - DAUGHTER BOARD PICDEM LCD 16F91XDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24FJ96GA010-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
100-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-110
B
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
β
p
c
§
#leads=n1
Dimension Limits
E1
E
Units
A2
(F)
D1
A1
E1
n1
D
n
p
A
L
E
B
α
φ
c
β
L
n
MIN
.037
.002
.018
.004
.007
Preliminary
11
11
2
1
0
D1
PIC24FJ128GA FAMILY
INCHES
.630 BSC
.630 BSC
.551 BSC
.551 BSC
φ
NOM
D
100
A1
.020
.039
.024
.039
.009
3.5
25
12
12
A
MAX
.047
.006
.030
.008
.041
.011
(F)
13
13
7
MIN
0.95
0.05
0.45
0.09
0.17
11
11
0
MILLIMETERS*
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
NOM
100
0.50
1.00
0.60
1.00
0.22
3.5
25
12
12
DS39747C-page 217
MAX
A2
1.20
1.05
0.15
0.75
0.20
0.27
α
13
13
7

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