PIC18F2520-E/ML Microchip Technology, PIC18F2520-E/ML Datasheet - Page 22

IC PIC MCU FLASH 16KX16 28QFN

PIC18F2520-E/ML

Manufacturer Part Number
PIC18F2520-E/ML
Description
IC PIC MCU FLASH 16KX16 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2520-E/ML

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP, SPI, I2C, PSP, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
1 x 8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
MCP3909RD-3PH1 - REF DESIGN MCP3909 3PH ENGY MTR
Lead Free Status / Rohs Status
 Details
PIC18F2XXX/4XXX FAMILY
3.4
The ID locations are programmed much like the code
memory. The ID registers are mapped in addresses,
200000h through 200007h. These locations read out
normally even after code protection.
TABLE 3-8:
DS39622L-page 22
Step 1: Direct access to code memory and enable writes.
Step 2: Load write buffer with 8 bytes and write.
Note:
Command
0000
0000
0000
0000
0000
0000
0000
0000
1101
1101
1101
1111
0000
4-Bit
ID Location Programming
The user only needs to fill the first 8 bytes
of the write buffer in order to write the ID
locations.
8E A6
9C A6
0E 20
6E F8
0E 00
6E F7
0E 00
6E F6
<MSB><LSB>
<MSB><LSB>
<MSB><LSB>
<MSB><LSB>
00 00
WRITE ID SEQUENCE
Data Payload
BSF
BCF
MOVLW 20h
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 00h
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2.
Write 2 bytes and post-increment address by 2.
Write 2 bytes and post-increment address by 2.
Write 2 bytes and start programming.
NOP - hold PGC high for time P9 and low for time P10.
EECON1, EEPGD
EECON1, CFGS
Table 3-8
write the ID locations.
In order to modify the ID locations, refer to the method-
ology described in
Memory”. As with code memory, the ID locations must
be erased before being modified.
Core Instruction
demonstrates the code sequence required to
Section 3.2.1 “Modifying Code
 2010 Microchip Technology Inc.

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