PIC16C55-XTI/SS Microchip Technology, PIC16C55-XTI/SS Datasheet - Page 175

• Manufacturer Part Number: PIC16C55-XTI/SS
• Description: IC MCU OTP 512X12 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C55-XTI/SS

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 20
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: OTP
• Ram Size: 24 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6.25 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• For Use With: 309-1026 - ADAPTER 28-SSOP TO 28-DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -

18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
A1
A
Preliminary
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
22.80
PIC16C5X
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
DS30453D-page 173
MAX
A2
L
22.99
10.92
3.68
8.26
6.60
3.43
0.38
1.78
0.56
4.32
15
15