PIC18F2221-I/ML Microchip Technology, PIC18F2221-I/ML Datasheet - Page 374
PIC18F2221-I/ML
Manufacturer Part Number
PIC18F2221-I/ML
Description
IC PIC MCU FLASH 2KX16 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(402 pages)
2.PIC18F2221-ISO.pdf
(8 pages)
3.PIC18F2221-ISO.pdf
(30 pages)
4.PIC18F2221-ISO.pdf
(46 pages)
5.PIC18F2321-IML.pdf
(396 pages)
Specifications of PIC18F2221-I/ML
Core Size
8-Bit
Program Memory Size
4KB (2K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
40MHz
No. Of Timers
4
Package
28QFN EP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
25
Interface Type
I2C/SPI/USART
On-chip Adc
10-chx10-bit
Number Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28QFN4 - SOCKET TRANS ICE 28QFN W/CABLEAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F2221-I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC18F2221-ISO PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2221-ISO PDF datasheet #4
- PIC18F2321-IML PDF datasheet #5
- Current page: 374 of 396
- Download datasheet (7Mb)
PIC18F4321 FAMILY
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS39689E-page 372
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
Preliminary
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
A2
E
MIN
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
© 2007 Microchip Technology Inc.
10.50
MAX
2.00
8.20
1.85
5.60
0.95
0.25
0.38
8°
–
φ
L
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